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Qualcomm Unveils New Snapdragon 7 Gen 3 for high-end Devices

Qualcomm Unveils New Snapdragon 7 Gen 3 for high-end Devices

Qualcomm Unveils New Snapdragon 7 Gen 3 for high-end Devices

  • Qualcomm has launched the Snapdragon 7 Gen 3, its latest midrange chipset.
  • The SD 7 Gen 3 offers enhanced performance and efficiency compared to its predecessor.
  • The chipset supports up to 4K resolution at 60 Hz for displays.

Qualcomm has introduced the Snapdragon 7 Gen 3, the latest addition to its midrange 7 series chipset lineup for mobile devices. Positioned between the SD 7+ Gen 2 and SD 7s Gen 2, this chipset offers enhanced features.

Built with TSMC’s 4nm process technology, the SD 7 Gen 3 employs a 1+3+4 CPU arrangement. This includes a main core running at 2.63 GHz, three performance cores at 2.4 GHz, and four efficiency cores at 1.8 GHz.

The Snapdragon 7 Gen 3 guarantees a 15% boost in CPU performance and a 50% rise in Adreno GPU speed compared to the previous model, the Snapdragon 7 Gen 1. Furthermore, Qualcomm’s assessments show a 20% increase in power efficiency.

The Qualcomm Hexagon NPU in the chipset provides 60% greater AI performance per watt compared to the SD 7 Gen 1. Additionally, the Adreno GPU in the 7 Gen 3 supports multiple APIs, including OpenGL ES 3.2, OpenCL 2.0 FP, and Vulkan 1.3.

Regarding display capabilities, the latest Qualcomm chipset supports up to 4K resolution at 60 Hz or FHD+ resolution at 168 Hz. It incorporates a Qualcomm Spectra ISP that can manage camera modules up to 200 MP and record 4K HDR video at 60 Hz. Paired with the Snapdragon X63 5G Modem-RF System, the SD 7 Gen 3 provides download speeds of up to 5 Gbps over mmWave and sub-6 GHz bands. Additionally, it is compatible with Wi-Fi 6E and Bluetooth 5.3.

Qualcomm Unveils New Snapdragon 7 Gen 3 for high-end Devices
Qualcomm Unveils New Snapdragon 7 Gen 3 for high-end Devices

The initial smartphones featuring the Snapdragon 7 Gen 3 are anticipated to launch later this month, with Honor and Vivo being among the first manufacturers to integrate the new chipset.

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